12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
The reference hub for the chiplet ecosystem
Where the chiplet marketplace starts with trust.
New Chiplets
Interconnect Chiplet
- Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
- Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
Automotive AI Accelerator
- Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.
HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
New Chiplet-Ready IP
High Performance Droplet
- High-Performance Analog Front-Ends (AFEs): Essential for data acquisition and signal processing in various applications.
- High-Speed Interfaces: Facilitating seamless communication between solutions. Omni Design supports various standards, including JESD204 and PCIe.
- Custom Solutions: Omni Design can tailor SoC solutions to meet specific customer requirements.
12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Insights
Ecosystem Highlights
NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics (NPO) Chiplet Solution with Interoperability for 1.6T
2026-01-13T12:31:20+00:00
CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
2026-01-12T07:20:00+00:00
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
2026-01-06T14:16:00+00:00
Expert Perspectives
Accelerating Chiplet Integration in Heterogeneous IC Package Designs
January 15, 2026
Visualizing Cross-Die Paths in Multi-Die Designs
January 14, 2026
5 Chiplets Design Challenges Hampering Wider Take-off
January 13, 2026
Scalable Testing of Xanadu’s Canadian made Quantum Photonic Chips with MPI Corporation’s Advanced Electro-Optic Probe Systems
January 12, 2026
Recent Updates
Business
Baya Systems Expands Bengaluru Engineering Hub to Scale AI, Automotive and HPC Innovation
2026-01-15T06:47:35+00:00
Photonics
Business
CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
2026-01-12T07:20:00+00:00
Chiplet Ecosystem
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
2026-01-06T14:16:00+00:00
Chiplet-Based Chips
Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
2026-01-06T12:30:00+00:00
Chiplet-Based Chips
TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
2026-01-06T08:04:47+00:00
Technical Library
Whitepapers & Technical Articles
The Road to 64G UCIe IP: What Designers Need to Know
January 14, 2026
Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
January 13, 2026
Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
January 7, 2026
High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
January 5, 2026
Videos
The State of Multi-Die: Insights and Customer Requirements
January 12, 2026
Coding approaches for increasing reliability and energy efficiency of 3D technologies
December 30, 2025
AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets
December 29, 2025
Rearchitecting AI Infrastructure with General Purpose and Accelerator Chiplets
December 17, 2025
